Services
SMT
SMT (Surface Mount Technology) forms the foundation of modern electronics manufacturing and is one of Hokami’s key technologies. Drawing on many years of experience, advanced equipment and carefully controlled manufacturing processes, we produce electronic assemblies from prototypes to high-volume production. Our aim is to provide customers with reliable, flexible and high-quality manufacturing solutions that meet the requirements of a wide range of industries.
fully automated
- 4 lines
SMT placements per month
- 40M+
mm, max. board dimensionsmax. board dimensions
- 810 by 480 millimetres810 by 480 millimetres
express production start
- 24 h
Manufacturing
Four automated SMT lines
Production runs on four fully automated SMT lines using modern Yamaha and Assembleon placement technologies. The manufacturing process is controlled with an emphasis on maximum precision, repeatability and the quality of every assembled joint. We routinely work with manufacturing documentation supplied by the customer and, when needed, provide technical support to optimise product designs for series production (DFM).
Soldering
Reflow soldering
After the SMD components have been placed, reflow soldering creates high-quality solder joints with lasting reliability. Our reflow ovens allow precise control of temperature profiles for both lead-free and leaded soldering, ensuring high manufacturing quality even for technologically demanding electronic assemblies. Our modern soldering technologies enable us to process a wide range of products, from standard industrial applications to electronics with stringent quality and reliability requirements.
Board dimensions
Our equipment can assemble printed circuit boards measuring up to 810 × 480 mm. Regular investment in manufacturing technology and automation enables us to respond flexibly to individual customer requirements and deliver technically demanding projects.
Production capacity
Our current production capacity exceeds 40 million SMT placements per month, allowing us to handle prototypes, medium-sized series and high-volume orders efficiently while maintaining high quality and short lead times.
Express production
For time-critical projects, we also offer an express manufacturing service, with production able to start within 24 hours of receiving the complete manufacturing documentation.
Equipment
Manufacturing equipment
SMT placement technology
2× Yamaha YSM20 Z
1× Yamaha YS24X
1× Yamaha YSM20-2B
1× Assembleon MG1-R
1× Assembleon Topaz Xi
Reflow soldering
1× SEHO PowerReflow
1× HELLER 1707 MKIII
1× SEHO Flowstar 4036 2.3
2× ERSA HOTFLOW 4/14
Wire bonding
Our technological capabilities also include gold-wire bonding, aluminium-wire bonding and Glob Top technology, enabling specialised applications that require advanced methods of interconnecting semiconductor components.
Contact
Looking for an electronics manufacturing partner?
By combining modern SMT technologies, precisely controlled reflow soldering, an experienced team and rigorous quality control, we offer customers comprehensive electronics manufacturing solutions focused on maximum reliability, flexibility and the long-term quality of finished products.
