Services
Cleaning
PCB cleanliness is an important factor in the quality of the finished product. Cleanliness throughout the manufacturing process is managed in accordance with IPC-CH-65B.
Process
Managed to IPC-CH-65B
PCB cleanliness is one of the key factors affecting the reliability, service life and long-term functionality of electronic assemblies. At Hokami, we pay close attention to cleaning and manage the process in accordance with IPC-CH-65B and our customers’ individual specifications.
In standard production we use modern no-clean solder pastes and fluxes that meet demanding requirements for solder joint quality and reliability. Where a project requires a higher level of surface cleanliness, we provide professional washing of assembled PCBs using automated cleaning technologies.
Technology
Ultrasonic cleaning and high-pressure spray
We combine ultrasonic cleaning and high-pressure spray to remove flux residues, ionic contamination and other contaminants. Precisely controlled processes deliver high levels of cleanliness even for technologically demanding electronic assemblies intended for industrial, medical or energy applications.
Each cleaning process is tailored to the customer’s requirements and the product’s characteristics, ensuring maximum reliability of the finished product while maintaining high manufacturing efficiency.
Manufacturing equipment
We clean electronic assemblies using modern equipment designed for professional industrial applications:
1× PBT ModuleClean – automated washing system with ultrasonic and spray modules
3× MDX01 – industrial washing equipment
Ultrasonic cleaners with bath temperature control and timed process control
Contact
Looking for an electronics manufacturing partner?
Modern cleaning technologies and carefully controlled processes enable us to deliver the required level of surface cleanliness in accordance with customer specifications and the needs of each application.
