The purity of the printed circuit boards is an important factor affecting the quality of the end product. Ensure cleanliness during the entire production process takes place according to the standard IPC-CH-65B.
The purity of the printed circuit boards is one of the key factors influencing the reliability, durability, and long-term functionality of the electronic assemblies. In the company of Hokami we devote to the process of cleaning the utmost attention and we provide its management in accordance with the requirements of IPC-CH-65B and the individual specifications of our customers.
In the standard production we use modern no-clean solder pastes and fluxes (Well Clean), which meet the high requirements for the quality and reliability of solder joints. If the project requires achieving a higher level of surface cleanliness, we provide professional washing of loaded printed circuit boards using automated cleaning technologies.
For the removal of residues of soldering fluxes, ion impurities and other contaminants, we use a combination of ultrasonic cleaning and high pressure spraying. Thanks to the precisely controlled process, we achieve high levels of purity, even in technology-intensive electronic assemblies intended for example for industrial, medical or energy applications.
Each cleaning process is adapted to the specific requirements of the customer and the nature of the product so as to ensure the maximum reliability of the final product while maintaining the high efficiency of the production process.
Technological equipment
For the cleaning of electronic assemblies, we use the modern equipment intended for professional, industrial applications:
- 1× PBT ModuleClean – automatic washing system with ultrasonic and postřikovým module
- 3× MDX01 – industrial washing equipment
- Ultrasonic dishwasher with the temperature control of the bath and the time-management process
Thanks to the modern cleaning technologies and strictly controlled processes, we are able to provide the desired level of surface cleanliness according to the customer specifications and the requirements of individual applications.
