SMT pcb assembly represents one of the key technologies of the company Hokami and form the basis of modern production of electronics. Thanks to years of experience, cutting-edge technological SMT (Surface Mount Technology) represents the basis of modern production of electronics and is one of the key technologies of the company Hokami. Thanks to years of experience, cutting-edge technological equipment and strictly controlled manufacturing processes we implement the production of electronic assemblies from prototypes to large scale production. Our goal is to provide customers with reliable, flexible and high-quality manufacturing solution to meet the requirements of various industries.
Production currently underway on four fully automated SMT lines using modern printing technology, the Yamaha and Assembleon. The production process is controlled with an emphasis on maximum accuracy, repeatability and quality of each mounted connections. By default, we process manufacturing documentation supplied by the customer and if necessary, we also provide technical support in the optimization of the design of the products from the perspective of serial manufacturing (DFM).
After mounting of SMD components is followed by reflow solderingthat ensures the creation of high-quality and long-term reliable solder joints. Our reflow ovens allow precise control of the temperature profiles for lead free and leaded soldering, thereby achieving a high quality of production and the technology-intensive electronic assemblies. Thanks to modern soldering technology we are able to handle a wide range of products from conventional industrial applications to electronics with high demands on quality and reliability.
We have the technology for mounting circuit boards with dimensions of up to 810 × 480 mm. Through regular investment in manufacturing technology and automation, we are able to respond flexibly to individual customer requirements and implement technically challenging projects.
The current production capacity exceeds 40 million SMT mounting a month, which allows us to efficiently manage our manufacturing, high series and high-volume orders, while maintaining a high quality and short delivery deadlines. For time-critical projects, we also offer an express production mode with the option to begin production within 24 hours from the delivery of complete production documents.
Technological equipment
SMT placement technology
- 2× Yamaha YSM20 OF
- 1× Yamaha YS24X
- 1× Yamaha YSM20-2B
- 1× Assembleon MG1-R
- 1× Assembleon Topaz Xi
Reflow soldering
- 1× SEHO PowerReflow
- 1× HELLER 1707 MKIII
- 1× SEHO Flowstar 4036 2.3
- 2× ERSA HOTFLOW 4/14
Bondování
Part of our technological background is also bondování using gold wire, aluminum wire, and technology Glob Top, which allows the realization of specific applications requiring advanced methods of interconnection of semiconductor devices.
Thanks to the combination of modern SMT technology, precisely controlled reflow soldering, an experienced team and strict quality control, we offer our customers comprehensive solutions for the production of electronics with an emphasis on maximum reliability, flexibility and long-term quality of the final products.
